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  • 35g Solder Flux Paste Soldering Tin Cream Welding Fluxes For PCB BGA SMD
  • [EPC_MAC_11I]
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35g Solder Flux Paste Soldering Tin Cream Welding Fluxes For PCB BGA SMD35g Solder Flux Paste Soldering Tin Cream Welding Fluxes For PCB BGA SMD35g Solder Flux Paste Soldering Tin Cream Welding Fluxes For PCB BGA SMD35g Solder Flux Paste Soldering Tin Cream Welding Fluxes For PCB BGA SMD35g Solder Flux Paste Soldering Tin Cream Welding Fluxes For PCB BGA SMD35g Solder Flux Paste Soldering Tin Cream Welding Fluxes For PCB BGA SMD35g Solder Flux Paste Soldering Tin Cream Welding Fluxes For PCB BGA SMD  
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  • Product Details

  • Specifications:
  • Usage:
    - Phone repair
    - PCB BGA SMD
    - Electronics welding, soldering.
  • Type : XG-500
  • Alloy : Sn63/Pb37
  • Microns : 25-45um
  • Weight : about 35 grams
  • Package Weight : 38 G / 1.34 Ounces
  • Package Dimensions (L*W*H) : 30*30*40 MM / 1.18*1.18*1.57 Inches
  • Retail Packaging: No, No Packing

  • Package Include:
  • 1 X Soldering Welding Paste
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